JPH0644099Y2 - 半導体素子用樹脂封止装置 - Google Patents
半導体素子用樹脂封止装置Info
- Publication number
- JPH0644099Y2 JPH0644099Y2 JP8322988U JP8322988U JPH0644099Y2 JP H0644099 Y2 JPH0644099 Y2 JP H0644099Y2 JP 8322988 U JP8322988 U JP 8322988U JP 8322988 U JP8322988 U JP 8322988U JP H0644099 Y2 JPH0644099 Y2 JP H0644099Y2
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- mold
- target temperature
- pid control
- target
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 title claims description 13
- 229920005989 resin Polymers 0.000 title claims description 13
- 239000004065 semiconductor Substances 0.000 title claims description 11
- 238000007789 sealing Methods 0.000 title description 7
- 238000006243 chemical reaction Methods 0.000 claims description 7
- 238000009529 body temperature measurement Methods 0.000 claims description 5
- 238000005538 encapsulation Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 4
- 238000010276 construction Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Control Of Temperature (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8322988U JPH0644099Y2 (ja) | 1988-06-22 | 1988-06-22 | 半導体素子用樹脂封止装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8322988U JPH0644099Y2 (ja) | 1988-06-22 | 1988-06-22 | 半導体素子用樹脂封止装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH024242U JPH024242U (en]) | 1990-01-11 |
| JPH0644099Y2 true JPH0644099Y2 (ja) | 1994-11-14 |
Family
ID=31307955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8322988U Expired - Lifetime JPH0644099Y2 (ja) | 1988-06-22 | 1988-06-22 | 半導体素子用樹脂封止装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0644099Y2 (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2537200Y2 (ja) * | 1990-11-28 | 1997-05-28 | エスエムシー 株式会社 | ラックピニオン形揺動アクチュエータ |
-
1988
- 1988-06-22 JP JP8322988U patent/JPH0644099Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH024242U (en]) | 1990-01-11 |
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